TITLE: Lead Process Integration Engineer
REQUIREMENTS: Master’s degree in Materials Science, Engineering, or a related field with no prior employment experience required.
ALTERNATIVE REQUIREMENTS: The employer will also accept Bachelor’s degree in Materials science, Engineering, or related field PLUS 60 months employment experience in a related field.
JOB DUTIES: Lead cross-functional internal teams in developing manufacturing processes and workflows for advanced 2.5D/3D semiconductor packaging used in high-speed silicon photonics C/L/O-Band transceiver systems for hyperscale data center and in-vehicle applications; Serve as a technical point of coordination with external partners to execute end-to-end Outsourced Semiconductor Assembly and Test (OSAT), including assembly, testing, and production ramp; Develop and execute data-driven process validation plans, including Design of Experiments (DOE) and capability analysis to establish and continuously improve stable, repeatable, and controlled manufacturing processes; Direct root-cause failure analysis and implement corrective and preventative actions (CAPA) to resolve manufacturing and process-related issues; Integrate and streamline multi-stage manufacturing workflows from wafer-level post-processing through die and substrate assembly to fully production-ready transceiver modules.
SCHEDULE: 40 hours per week, Monday – Friday.
SALARY: $170,248 per year.
CONTACT: Send resumes by email to:
O-Net Communications (USA), Inc.,
Attn: Krena Solheim, Administration Manager,
KSolheim@o-netusa.com
Jobsite: 2235 Zanker Road, San Jose, CA 95131 (Full-Time Position)
